Electronics Forum | Fri Feb 10 13:30:31 EST 2023 | rwyman
Yes, that point remains unchanged. Just a general comment that there have been updates. e.g. re: desiccant re-use, certain devices no longer requiring bake-out, or bake times have been adjusted, and more.
Electronics Forum | Mon Jul 16 15:47:52 EDT 2012 | davef
Here's what Desco says ... Humidity Indicator Card (HIC) A card on which a moisture-sensitive chemical is printed such that it will change color from blue to pink when the indicated relative humidity is exceeded. This is packed inside the moisture-se
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
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