Electronics Forum: dewetting root cause (Page 1 of 45)

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Jul 30 20:38:02 EDT 2012 | davef

I'm with you on microcracking. The best way to confirm this is through sectioning of the affected capacitors. You're fortunate to be seeing these failures showing-up early in your product life. Of times these failures don't appear for years.

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway

I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 13:16:23 EDT 2012 | rway

Most likely the depaneling is not your issue, but I do concur that there is some mechanical stress occurring somewhere. What about any fixturing for FT/ICT?

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 12:48:47 EDT 2012 | tpatrickwalsh

They are using the method where scored boards are separated using a rotating wheel / blade. I realize this is not the best process, however these capacitors are more than 10 mm from the edge of the board. From some reading online I think that means

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 13:18:50 EDT 2012 | rway

I also forgot to mention that the pizza-slicers you are using can get out of spec and may need periodic calibration. By cutting too close, these can over-stress your pcbs as well. Do you only see this problem at one cutter or does it matter? Also,

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Thu Aug 23 00:38:17 EDT 2012 | isd_jwendell

"The problem is we haven’t changed anything in our design, and this has never happened before in 4-5 batches of production." If nothing has changed (same parts, same oven profile, same de-paneling, etc.), could the parts themselves have changed? I h

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier

Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh

I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing

solder balls - Possible root causes

Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan

Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask

What cause Solder Wicking ?

Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin

| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin

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