Electronics Forum | Thu Nov 03 07:22:16 EST 2005 | davef
arnold: I did not say that Sn100 dissolved copper faster. The graph of dissolution rates [from the link above] shows that Sn100 dissolves copper slower than many of the other solders.
Electronics Forum | Wed Mar 12 11:41:41 EDT 2008 | gregoryyork
Blimey just seen the picture that is bad. You could try to dissolve some of the residue/gunge in IPA if it is flux residue it should readily dissolve if it is resist issue then only portions will dissolve leaving a white powder which is Talc If you
Electronics Forum | Tue Jul 05 17:16:01 EDT 2005 | davef
We agree with Pat, but it's far from straight forward. [er maybe we should say we don't understand it.] We duplicated the results of a posting on the web. Flux, then dunk copper wire into tinning pots set at 250*C for measured periods of time. The
Electronics Forum | Sat Nov 21 09:13:57 EST 2009 | patrickbruneel
In addition to Dave’s response Yes tin dissolves (corrodes) other metals even at room temperature, just a whole lot slower. The affinity of tin to dissolve other metals is most effectively neutralized with the addition of lead. It is not by accident
Electronics Forum | Tue Feb 18 11:47:50 EST 2014 | rgduval
Is there a reason you're considering bead-blasting the conformal coating? It seems like a bit of overkill. Most of the cc that I've used over the years either has a solvent that will dissolve it, or will dissolve with heat. Heat has been our go-to
Electronics Forum | Mon Apr 29 09:54:46 EDT 2002 | davef
MadReindeer If this white residue is salt, * Why do you say is the presence of it 'not dangerous it only looking bad'? Don't salts sometimes go into solution with moisture on the board from humidity in the air and form cathodic plating shorts betw
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Tue Sep 09 09:04:17 EDT 2008 | davef
Oh that's GREAT. Now, we're encouraging engineers blow to saliva on boards. The saliva is made 99.5 percent of water and 0.5 percent of dissolved inorganic compounds. One third of the 0.5 percent are dissolved metal-ions such as Ca2+, Na+, K+, Cl- a
Electronics Forum | Thu Feb 05 18:16:37 EST 2009 | adamcrum
Can somebody help me to understand what standards are in place for deinozed water for cleaning circuit boards. I know they are supposed to be in acordance with J-STD-001D, but what does that entail? All I can find on the internet is that J-STD-001D a
Electronics Forum | Thu Feb 05 19:40:37 EST 2009 | davef
There is no standard for deionzed water when used to clean boards. As you state, J-STD-001 defines a cleanliness requirement and a method for determining cleanliness. How you go about meeting that requirement is your decision, as it should be. Fresh
