Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Fri May 29 13:42:34 EDT 1998 | Steve Gregory
Hi Jason! I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. If you have a board around that has some 1206 locations all in a row, print the board with paste and then plac
Electronics Forum | Fri May 29 16:12:11 EDT 1998 | Jason Gregory
| Hi Jason! | I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. | If you have a board around that has some 1206 locations all in a row, print the board with paste and the
Electronics Forum | Thu Mar 21 16:45:31 EDT 2013 | dyoungquist
We have been using a Heller 1707EXL (7 zones + 1 cooldown zone) for lead free (ROHS) soldering since 2007 with good results. I wouldn't go any lower than 7 heat zones though. If I may brag a bit....The IPC-7095 revision C standard was released a fe
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Thu May 20 03:34:56 EDT 1999 | Earl Moon
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | | Omat baby, Mo
Electronics Forum | Fri May 21 13:57:02 EDT 1999 | KA Stillings
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | |
Electronics Forum | Thu May 20 15:07:12 EDT 1999 | JohnW
Earl, your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of the compon
