Electronics Forum | Tue Sep 14 18:33:38 EDT 1999 | Mark Belec
I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts.
Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Tue Feb 04 18:46:01 EST 2003 | slthomas
"Use the pad mating to lead wetting area." If I get your drift, we're talking about the minimum lead area (assuming the pad has an area that's at least as large as the lead) required to be wetted by IPC-610. Hmmmm...that would take some calculation
Electronics Forum | Wed Apr 13 16:57:49 EDT 2005 | bradlanger
My company is just starting to do double sided smt. What options are available for under board support for printing and placing the second side? We are using a Dek 248 printer and Samsung CP Series placement machines.
Electronics Forum | Thu Apr 14 06:51:02 EDT 2005 | chandran
what product u are running memory or mother board
Electronics Forum | Thu Apr 14 13:20:29 EDT 2005 | pr
http://www.grid-lok.com/ good stuff! good luck, pr
Electronics Forum | Sun Oct 31 19:39:26 EST 1999 | Pat Copeland
Parts are falling off on first side when reflowing second side, have tried changing temp profiles, and ended up using tin foil. any recomendations.
Electronics Forum | Mon Nov 01 06:19:45 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Nov 01 06:27:15 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Tue Nov 09 21:27:13 EST 1999 | Dave F
Gary: This could be messy is some applications, because Bi will form an alloy with lead with a melting point of 93�C. My2� Dave F
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