Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Fri Mar 06 07:15:38 EST 2015 | saoasasd
Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Noteboo
Electronics Forum | Wed Mar 17 17:14:49 EST 1999 | Michael Allen
Another test to consider is dye penetrant analysis. The technique involves flooding the area beneath the soldered part with dye (preferably a bright color, like red). After drying the board+dye in an oven, you peel or torque the part off and inspec
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