Electronics Forum | Mon Oct 20 18:53:39 EDT 2014 | warwolf
pci express x1? https://www.google.co.nz/search?q=pci+express&client=firefox-a&hs=ZJi&rls=org.mozilla:en-GB:official&channel=sb&source=lnms&tbm=isch&sa=X&ei=DZJFVKvRDaXemAXaxoCgDA&ved=0CAgQ_AUoAQ&biw=1173&bih=849#rls=org.mozilla:en-GB:official&chann
Electronics Forum | Thu Oct 02 10:55:37 EDT 2003 | caldon
Brad- The Spec can be downloaded free from IPC at http://www.smema.org/smema1.2.pdf (or IPC.org search for SMEMA Standards). As per Conveyor edge clearance should be .187" or 4.7mm. Regards, Cal Communications Test Design, Inc. www.ctdi.com
Electronics Forum | Thu Mar 14 09:21:38 EST 2002 | davef
You should be looking for a better method of depaneling your boards. Listen. If you breaking components, it's not the component. It's you. Either you are: * Applying too much force. * Bending the board too much. * Locating the components too clos
Electronics Forum | Thu Mar 31 10:14:06 EST 2005 | davef
There's some nice low-VOC uV coatings out there. We don�t use uV cured coatings, but try: * http://www.emersoncuming.com * http://www.dymax.com * http://www.mgchemicals.com * http://www.loctite.com * http://www.humiseal.com Be aware that uV co
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t
Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam
Electronics Forum | Fri May 11 17:21:04 EDT 2001 | davef
Three main groups of depaneling equipment are: 1 Scoring: Limited to straight edges and mainly 90� angles 2 Routing: And a cloud of dust 3 Singulating: Hard tooled by board To get started understanding the suppliers look here: http://www.cassembly.c
Electronics Forum | Wed Jan 12 10:15:43 EST 2005 | davef
We conformal coat our boards and get pretty good coverage along the edges of BGA. If you need coverage along the edges and are not getting it, your supplier may be able to recommend a different material or application method. Most often, underfill
Electronics Forum | Wed Jun 11 18:22:41 EDT 2003 | Steve
Do you happen to know where I may find a supplier for the "little mirror"? Google didn't produce relevant search results for Mentor. My method of inspecting possible bridging under a BGA involved a small flashlight placed up against the edge of the
Electronics Forum | Thu Jun 05 21:59:22 EDT 2008 | mika
bsumfg, The very best anybody said lately!! This should go straight into the the manual! I totally agree with you; Just an add: The fid's should never be mistaken for a test point who normally is between 1.0 - 1.27 mm so make the fids 1.5 mm. round
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