Electronics Forum | Mon Aug 19 13:32:54 EDT 2019 | aqueous
ROSE testing a post-reflow assembly which has been reflowed using no-clean flux may not yield information that is helpful. No-clean flux technology works by encapsulating the flux's activators and other chemical constitutes that would be harmful if l
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Mon Jan 14 23:02:52 EST 2008 | davef
You don't mention any particular IC or manufacturer or marking method. However, most IC marking is done with lasers these days. The laser actually alters the encapsulation so the only way to erase the marking is to remove the encapsulation. Otherwise
Electronics Forum | Tue Mar 31 08:08:32 EST 1998 | Michael Mallery
I am looking for information on TSOP encapsulating materials. Also, any manufacturing companies that sell TSOP's daisy chained for electrical functional thermal cycling.
Electronics Forum | Fri Dec 16 10:25:37 EST 2005 | solderiron
Rather than cleaning a water soluble flux residue off the board, by encapsulating the product. covering the board or the component with lets say a Hysol encasulant. Would this prevent the active flux residue from migrating and deteriorating the elect
Electronics Forum | Tue Mar 29 10:47:31 EDT 2011 | frcdave
I agree with Davef, there is no point in conformal coating the assembly before potting. I am also not aware of any IPC standard for potting or encapsulation. If you would like to discuss equipment for potting/ encapsulation, we would be happy to d
Electronics Forum | Mon Jun 05 14:08:41 EDT 2000 | Bob Smith
I am trying to find the plastic family used in manufacturing the bodies of integrated circuits. Usually our product is fully encapsulated in ScotchCast however a new application requires part of a pressure sensor chip to be free of encapsulant. The S
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
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