Electronics Forum | Mon Jul 20 04:19:01 EDT 1998 | Michael Jeremias
Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ?
Electronics Forum | Wed Jul 22 16:00:24 EDT 1998 | David A. Pinsky
| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? We have performed failure analyses on PEM's in our lab for many years. The vast majority of pa
Electronics Forum | Wed Jul 22 00:43:05 EDT 1998 | P.L. Sorenson - Technical Consultant
| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? My personal experience using PEM for military avionics applications has been very positive. H
Electronics Forum | Wed Jul 22 15:48:35 EDT 1998 | David Pinsky
| | Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? | My personal experience using PEM for military avionics | applications has been very positi
Electronics Forum | Mon Aug 19 13:32:54 EDT 2019 | aqueous
ROSE testing a post-reflow assembly which has been reflowed using no-clean flux may not yield information that is helpful. No-clean flux technology works by encapsulating the flux's activators and other chemical constitutes that would be harmful if l
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Mon Jan 14 23:02:52 EST 2008 | davef
You don't mention any particular IC or manufacturer or marking method. However, most IC marking is done with lasers these days. The laser actually alters the encapsulation so the only way to erase the marking is to remove the encapsulation. Otherwise
Electronics Forum | Tue Mar 31 08:08:32 EST 1998 | Michael Mallery
I am looking for information on TSOP encapsulating materials. Also, any manufacturing companies that sell TSOP's daisy chained for electrical functional thermal cycling.
Electronics Forum | Fri Dec 16 10:25:37 EST 2005 | solderiron
Rather than cleaning a water soluble flux residue off the board, by encapsulating the product. covering the board or the component with lets say a Hysol encasulant. Would this prevent the active flux residue from migrating and deteriorating the elect
Electronics Forum | Tue Mar 29 10:47:31 EDT 2011 | frcdave
I agree with Davef, there is no point in conformal coating the assembly before potting. I am also not aware of any IPC standard for potting or encapsulation. If you would like to discuss equipment for potting/ encapsulation, we would be happy to d
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