Electronics Forum: enig sac (Page 1 of 4)

How low temperature solder joint can survive

Electronics Forum | Wed Jan 07 17:39:26 EST 2015 | duchoang

Additional info: I use SAC305 solder paste on Enig PCB.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 21:24:14 EDT 2021 | kwalker

No, you're correct. Nickel oxidation can be difficult to remove

LGA voiding

Electronics Forum | Tue Dec 31 11:48:36 EST 2019 | emeto

Hello experts, I have a 50mmx50mm LGA on a PCBA. I Would like to decrease voiding in these joints and I wanted to hear about your techniques to decrease voiding. Stencil is currently 5mil. SAC305. ENIG finish.

THM Solder barrel fill issues on 93 mils board

Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew

I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag

Lead-free solder alloy: SN100C from AIM solder

Electronics Forum | Wed Jul 27 17:18:07 EDT 2005 | Carl

Any issues in your experience using SAC305 for reflow and SN100C for wave on ENIG pcbs? I've seen the CD, but there's not much specific data regarding ENIG pcbs Thanks

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Thu Apr 15 19:58:40 EDT 2021 | jimpat

In addition to confirming that the pad temperatures reach above the melting point of the preforms, consider checking the O2 PPM concentration.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 07:46:14 EDT 2021 | jeremy_leaf

I have tried cleaning the pads. That was our first step. Ultrasonic cleaning in acetone and IPA, and also tried etching in a 10% HCL solution. Our board is definitely achieving the correct temperature.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 07:50:09 EDT 2021 | jeremy_leaf

@KWalker I think that could be the case. Though I read somewhere a while back that nickel oxidation can be quite tough to remove, even with flux. Am I wrong about that?

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 19:08:04 EDT 2021 | emeto

Jerry, just out of curiosity, why can't you use flux? Flux is essential part of soldering and it is there for multiple reasons. Flux we can also clean afterwords - even No Clean.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 21:22:57 EDT 2021 | kwalker

The fact that your cleaning didn't really help reinforces that it probably is oxidation. Cleaning won't remove that.

  1 2 3 4 Next

enig sac searches for Companies, Equipment, Machines, Suppliers & Information

Software for SMT

High Throughput Reflow Oven
See Your 2024 IPC Certification Training Schedule for Eptac

Best Reflow Oven
SMT feeders

Smt Feeder repair service centers in Europe, North, South America
Electronics Equipment Consignment

Training online, at your facility, or at one of our worldwide training centers"
SMT feeders

High Precision Fluid Dispensers
Assembly Automation Technology

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...