Electronics Forum: epoxy cure (Page 1 of 22)

Re: stencil epoxy debonding

Electronics Forum | Fri Apr 28 21:33:01 EDT 2000 | JP

I had a similar problem. We wold begin to notice the debonding within hours after recieving the stencils. As it turned out, our stencil vendor, located in CA, was shipping the stencil to our facility, located in ND, before the epoxy was fully cured

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 16:03:14 EST 2001 | blnorman

You're right, manufacturers time/temps will vary. A single manufacturer will have a host of materials with different cure schedules. We currently use 2 epoxies that cure in 2 - 3 minutes at 150�C. One will also cure in 5 minutes at 125�C. Talk t

Is more epoxy better?

Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef

Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab

Non-conductive epoxy discoloration

Electronics Forum | Thu Feb 26 21:35:21 EST 2015 | flyingsnow

Hi, has anyone experienced discoloration of cured non-conductive epoxy? It turned from white to deep red. The parts were returned from customer and we noticed the color change and wondered what could cause epoxy discoloration.Thank you!

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: stencil epoxy debonding

Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber

There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman

Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman

I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of

Reflow cure of E-30cl epoxy, anyone ever done it?

Electronics Forum | Thu Feb 21 15:26:58 EST 2013 | markhoch

I'd be leery curing the E-30cl Material at temps above 90 degrees C. (I believe the flashpoint is 93 Degrees C)

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