Electronics Forum | Tue Oct 17 15:31:29 EDT 2006 | TM
I've got some MELF packages that reflow and connect but later fall out of the solder pretty easily. We are not using epoxy but, the parts have fillets per IPC standards. We have not looked at cross-sectioning for IMC and don't plan to at the moment
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Mon Jun 14 08:48:29 EDT 1999 | Adam Pratt
| | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from man
Electronics Forum | Mon Jun 14 11:39:29 EDT 1999 | Marshall
| | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from m
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Tue Aug 24 11:36:37 EDT 1999 | Jimmy G
| | | | Hello everyone, | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advanc
Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T
| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad
Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i
Electronics Forum | Mon Dec 11 03:46:14 EST 2000 | JohnW
I have to say I've never heard of anything tombstoning over wave, I've seen issues where the glue dot is too high or off to one side creating a poorly seated component that has too big a gap between pad and endcap(and hence an open), but never a tomb
