Electronics Forum: faceing (Page 5 of 70)

Component staking

Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD

Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking

Printing smear

Electronics Forum | Fri Dec 10 02:26:16 EST 1999 | Tracy Guo

Hi, I'm facing smear after printing on DEK288 using reverse squeegee at the edge of panels. I've checked the fixture, printing parameter, stencil, solder paste. What else can I do?

Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 15:55:26 EDT 1999 | Roberto Cardozo (Brazil)

Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"?

Misalignment in TBGA?

Electronics Forum | Wed Jul 29 20:18:35 EDT 1998 | Karlin

Hi, I am current facing misalignment issues after reflow on TBGA. Do any one have experience in it? rgs, karlin

Waving TSOPs

Electronics Forum | Fri May 08 12:46:25 EDT 1998 | Greg Curler

As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? Any advice is appreciated. Greg

QUAD 4-C

Electronics Forum | Wed Jan 28 19:53:02 EST 1998 | NAZEEH CHAUDRY

We are facing some placement problems with our QUAD 4-C. Program was running fine last week, Next week program will be off (placement, pickup,vision files etc, Any help, any idea,??? Thanks

QUAD 4-C

Electronics Forum | Wed Jan 28 19:52:16 EST 1998 | NAZEEH CHAUDRY

We are facing some placement problems with our QUAD 4-C. Program was running fine last week, Next week program will be off (placement, pickup,vision files etc, Any help, any idea,??? Thanks

bridging between 2 pads

Electronics Forum | Wed Nov 07 18:37:27 EST 2001 | steven

sometime hand solder can cause also. no necessary have to be paste n reflow.:) now i'm facing bridging on 0402 components pads. any suggestions on spacing distance as we're going to re-design the pcb.

High-mix, Low-volume Manufacturing

Electronics Forum | Mon May 20 23:01:16 EDT 2002 | dwoon

Hi guys, What are the major inefficiencies that most EMS companies faced in a high-mix/low-volume manufacturing? And, what in general an equipment manufacturer (especially surface-mounting equipment manufacturer) can help them to improve the product

UltraSonic cleaning machine

Electronics Forum | Wed Sep 25 10:13:32 EDT 2002 | davef

I don't think 'this a blatant violation of rules' as such. I think it is a blantant disrespect of the principle of free and open communication that is the corner stone of interenet forums and a slap in the face of everyone that wants to learn more a


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