Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Tue Dec 21 20:05:01 EST 1999 | Chris
Try Flip Chip Technologys. They have several daisy chain flip chips. One is called FP250. .250 X .250 solder bumped flip chip. Try Technet too. Remember seeing several other manufactures of daisy chain die. Maybe Unitive at www.unitive.com can
Electronics Forum | Tue Feb 06 21:11:27 EST 2001 | Frank
Does anyone know if the Quad ASP machine uses a die wafer feeder manufactured by Laurier. I have experience with the Laurier wafer die handlers and thik they really work well. I am thinking about Quad ASP for a flip chip placement machine. Thanks,
Electronics Forum | Tue Dec 19 07:58:29 EST 2006 | ccgooi
Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabil
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
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