Electronics Forum | Mon Nov 01 15:47:21 EST 1999 | Jim Snipes
Dave thaanks for your quick reply. The flow through probelm exists on several component, Examples; small Tan electolic caps.,electrolic epoxy caps. and one specfic lad on a resistor network. I have veried conveyor speed and readjusted heat sett ings
Electronics Forum | Wed Dec 06 07:24:22 EST 2006 | davef
Successful solder paste overprint is a function of the solder paste rheology, solder mask and through hole component stand off. * Solder mask with a high surface energy will permit a larger overprint than a solder mask with a lower surface energy. In
Electronics Forum | Thu May 01 09:26:53 EDT 2008 | scottp
Voiding was also the issue I had. I could reduce them substantially by pre-baking the boards, but that's obviously not desirable. Hopefully the chemists have come up with a solution. I extruded some pretty cool looking solder shorts through the vo
Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain
You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Sep 12 15:51:29 EDT 2013 | gregp
Hi Dean, Thanks for the feedback. I suppose I should reveal the nature of my query. Contact Systems was founded by my father back in 1970. I worked there from 1983 until we closed the doors back in 2009. I acquired the assets and intellectual pro
Electronics Forum | Wed Feb 05 10:31:38 EST 2003 | bpan
Hello Everyone, Is anyone out there building smt boards that have plated through vias directly located through the pads. We are seeing some of these designs and the soldering is very poor because the solder is flowing through the via. We think that w
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
