Electronics Forum | Tue May 11 08:35:26 EDT 2010 | cyber_wolf
If you see flux separation mix the paste with a spatula before you transfer it. There is no need for a centrifugal mixer.
Electronics Forum | Thu Jul 10 10:25:05 EDT 2008 | gregoryyork
I guess the paste is Leaded hence the 220 Peak temp and the Sn100c is Eutectic at 227C so you need to be hotter to melt the HASL finish or you are relying on it alloying together with the paste which takes much longer. suggest running peak temp of 23
Electronics Forum | Fri Sep 14 08:24:19 EDT 2007 | davef
Sure, it's possible to transfer water soluable flux from boards to tray to boards with low residue flux. We have never heard of this try of problem.
Electronics Forum | Fri Sep 12 06:02:55 EDT 2003 | Neil Trelford, Nortel
Even though you use a no clean process, it is still possible that some type of fluid has created the "short". Production lines are notorious for using cleaning chemicals on PCBs to clean excess flux after rework on other areas. Unless this type of c
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Mon Feb 18 11:08:59 EST 2002 | Claudine Y. Corda
Ashok, a few suggestions.......steel/brass fittings anywhere in the flux line can cause that problem; also, check the transfer tank (if used) for cleanliness . There may be a problem with the pump, if you are using Sono-Tek's SonoFlux system then p
Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain
You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for
Electronics Forum | Wed Aug 23 16:29:16 EDT 2000 | Dr. Ning-Cheng Lee
The surface tension of solder you mentioned should be referred to as interfacial tension between solder and flux. According to Antonow�s rule, the interfacial tension is the difference in surface tension of molten solder and liquid flux. Since flux a
Electronics Forum | Fri Feb 08 08:00:48 EST 2002 | caldon
Yet Again Dave spills his pearls of wisdom. Dave is correct in the moisture content wood absorbs. I know we have all visited factories with wood board holders and such. I have actually seen wood carts with drag chains. Also, keep in mind static can b
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