Electronics Forum: glueing components (Page 1 of 42)

Skewed components

Electronics Forum | Tue Apr 24 20:26:00 EDT 2001 | kcw

We solved similar problems some time ago. Check the volume dispensed or printed. Also check that the glue or solder paste has not expired and if in doubt use a new cartridge or change supplier. Ensure the Z axis stroke and placement force is corre

Glue on 0402 components

Electronics Forum | Mon Nov 02 19:04:14 EST 2009 | dcell_1t

Hi there, I'm looking for some info on how to glue 0402 components... I wonder if you can share some info, I think is pretty hard and I want to know your experiences. thanks!

Glue on 0402 components

Electronics Forum | Tue Nov 03 10:56:07 EST 2009 | dcell_1t

0402 will be glued on a fuji GL

Glue on 0402 components

Electronics Forum | Tue Nov 03 16:28:53 EST 2009 | davef

We have never dispensed adhesive for 0402, but here's your rules of thumb: * Nozzle diameter should be half the desired glue dot diameter. * Minimum of 0.010" gap between the adhesive and pad, both sides. We'd guess that you should be using a 0.3mm

Glue on 0402 components

Electronics Forum | Tue Nov 24 23:55:58 EST 2009 | henry_usa_stencils

You can order the glue stencil at http://www.usastencils.com They can design the opening of the apertures on the stencil in the middle of the caps so you can screen an adhesives through the opening then you will have it right on the center of the cap

Solder under bottomside SMT components

Electronics Forum | Wed Jun 24 18:50:55 EDT 1998 | John Silvestri

Has anyone seen a problem with solder under chip components, in-between the glue and the component or in-between the mask and the component? We seen both. What could be causing this? This has only been detected on one of our products. All the rest w

Re: SMT components Fall Off

Electronics Forum | Mon Jun 14 15:50:07 EDT 1999 | JohnW

| I am looking for more information about: | | 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; | | 2) There is some influence of doble wave solder machine (temperature, flux, etc) i

smt components vs. wave solder

Electronics Forum | Sat Nov 09 08:04:52 EST 2002 | erhard

if you wave solder you have to glue the SMD parts on the bottom side. If you reflow the bottom side then you usually shouln't go over the wave afterwards. It's quite logical the joints melt again, that's what you want to achieve going over the wave.

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais

The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics

The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi

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