Electronics Forum | Sat Nov 23 08:10:43 EST 2002 | jax
BS4292: Electroplated Coatings of Gold and Gold Alloys Gold and gold alloys for engineering purposes Single, double or multilayer electrodeposited coatings on metallic and non-metallic materials for electrical, electronic and other engineering appl
Electronics Forum | Sat Nov 23 06:28:23 EST 2002 | Alistair Johnston
I work for A PCB manufacturer and have a request to plate a board with Gold to BS4292. We dont hold this spec and wonder if anyone can explain what is entailed in this spec.
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Mon Aug 16 20:32:10 EDT 2004 | davef
First, we didn't say "electrolytic soft gold with a minimum thickness of 5-8 of Au". We said, "'electrolytic soft gold' thickness 5 to 8uin". FOCUS. ;-) Second, we're unaware of an industry accepted specification that you can reference. IPC-2221
Electronics Forum | Thu Nov 11 15:55:53 EST 2010 | davef
We guess the nickle has a rougher that normal finish AND the gold is at or below your specification. The nickle bumps are poking through the gold and are oxidized, preventing contact with you ATE probes. If this is correct, it would be interesting
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Thu Jul 15 18:58:48 EDT 1999 | Earl Moon
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Mon May 12 22:40:19 EDT 2003 | nyazga
I have always heard to use solder with 2 percent silver to reduce gold embrittlment. One vendor site said this is a myth. Does anyone know of a specific document recommending this such as IPC or MIL spec. ???
