Electronics Forum: gold tarnishing (Page 2 of 3)

Soldering problem with Au plating PCB

Electronics Forum | Mon Jan 26 13:13:07 EST 2009 | rgduval

We've had this same problem with the solder wicking to the component terminations. However, in our case, we did not see the pads turning a silver-white color...rather, they exhibited a tarnishing/darkening of the gold. We determined that we had som

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 17:58:01 EDT 1999 | Boca

| My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side it wo

ENiG or IAg? Which is better?

Electronics Forum | Thu Mar 06 11:48:09 EST 2008 | muse95

Black pad with IAg??? Tarnish is NOT black pad. Tarnish is usually just some silver sulfide on the surface and can also usually be soldered through, by using a little additional, or slightly more agressive, flux, and still make a good quality solder

Re: Silver Thru' Hole

Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB

Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup

| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Changing Ni/Au finish to HASL lead free

Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse

Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner

| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins

Re: Wave solder edge covers

Electronics Forum | Thu Jul 01 14:47:10 EDT 1999 | Tony

| | | My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)


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