Electronics Forum: gsm2 design flaws (Page 1 of 2)

Tombstone components issue after reflow?

Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson

Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice

There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with

LINEAR VOLT REG Polarity diagonally opposite

Electronics Forum | Mon Aug 11 08:47:31 EDT 2008 | davef

Your MPI (Inspection Procedure) is certainly flawed. Your MPI should have caught this on the first board your produced, before it was reflowed. For help convincing yourself the part is rotated 180*, your choices are: * Get the pin-out of the compone

DEK vs EKRA

Electronics Forum | Fri Sep 24 12:20:58 EDT 2004 | Simon UK

Hi there, I have been using DEK's of all types over the past 9 years, with a few SMTech's and MPM's thrown in for good measure. I personally would recommend using DEK, they may seem expensive, but i find that worth the cost with the good support we

bad connections, or not?

Electronics Forum | Fri Jan 12 16:35:00 EST 2001 | Steve Thomas

I've got a question: Can a joint look good externally, even under 45X magnification, and not be mechanically and/or electrically sound? I thought that if the wetting angles were sufficient, there's no discoloration from extreme thermal distress, or

Solder bath eruptions

Electronics Forum | Mon Mar 07 22:23:40 EST 2005 | mrduckmann2000

Ken, You nailed it! We have a Electrovert Vectra wave solder machine that will erupt solder all over the place while heating up, we had to disable the timer because of all the solder splatering. Electrovert told us that our machine had a small des

I am looking for an IPC spec for intentional PCB warp

Electronics Forum | Mon Dec 22 13:54:25 EST 2014 | proceng1

My customer made a process change to overcome a design flaw. The PCB assembly mounts in a plastic housing. The PCB mounts to the front housing via plastic stand-offs. They had to change a connector on the back side of the assembly due to long term

Re: Breaking scored boards, breaking components.

Electronics Forum | Tue Nov 16 10:53:25 EST 1999 | Scott Cook

Ok, help me out here guys and gals...... I have never understood the concept of scoring on mixed technology or SMT boards. It is quite obvious to me that the potential for SMT solder joint damage through the mechanical stresses of breakout are high.

0402 bridging

Electronics Forum | Wed Jun 03 15:45:36 EDT 2015 | ldempsey

Well, it took me a while but I had a look at some gerbers. On a PCB with neighboring 0402's 0.006" apart, and paste reduced 0.75mil on each side, I get lots of bridging. On a later rev of the same PCB, we have neighboring 0402's 0.018" apart,and pa

Re: PCB Material selection

Electronics Forum | Mon Jun 26 20:34:14 EDT 2000 | Dave F

Gary: Allow expand on this topic a bit. Back in the gray skied past when people wore calculators on their belts, rather than pagers n Palms, and didn�t drink California spill, they used HASS that you mentioned and HALT (Highly Accelerated Life Test

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