Electronics Forum | Sat Jun 11 06:33:27 EDT 2016 | fady
i'm new to pcb design and i'm wondering that starting from which frequency range we need to apply the high speed PCB design rules and techniques ?
Electronics Forum | Thu Aug 04 10:38:23 EDT 2016 | richardlawson1489
Here is a video for high speed pcb design rule and techniques. https://www.youtube.com/watch?v=BlHLmQ2HO1w This may help you.
Electronics Forum | Tue Aug 02 06:30:04 EDT 2016 | technotronix
I think it is normally from 4.0 to 5.0
Electronics Forum | Sat Jun 11 07:58:17 EDT 2016 | davef
IPC-2252 - Design Guide for RF/Microwave Circuit Boards IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits IPC-2141A - Design Guide for High-Speed Controlled Impedance Circuit Boards IPC design standards https://portal.ip
Electronics Forum | Thu Jun 25 12:04:58 EDT 1998 | Brian Munzel
looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. thanks for you time
Electronics Forum | Fri Oct 09 04:36:00 EDT 2009 | andrzej
Thanks. Unfortunatelly I did not find answer on my question. Dispensing glue generally has much worse output then printing glue. Question remains - how output of printing paste is compared to output of printing glue ?
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
Electronics Forum | Thu Oct 08 07:29:51 EDT 2009 | andrzej
We have 250x340mm panel of PCBs. Stencil for glue would be 0,3mm with about 80 holes mostly for chip components. Our MPM printer at standard set, prints paste on 1 panel at 40-50sec. I need general information if printing glue is faster or slower p
Electronics Forum | Thu Oct 08 08:08:53 EDT 2009 | davef
Look here for some guidelines: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=59924
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
