Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef
See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th
Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon
| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri
Electronics Forum | Fri Jul 10 14:23:23 EDT 1998 | Bob Willis
You can get a report and CD ROM on pin in hole reflow assembly from the SMTA main office in the USA. They also have a new report on Double Sided Reflow Design and Assembly. | Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help ear
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Thu Jul 26 22:52:47 EDT 2001 | davef
GT 8 years ago every board saw "touchup". Touch was done to fix boards to conform to A-610. Now A-610 allows less than complete hole fill. Our operators were totally freaking nuts about touching boards. They touched each others touch and on and o
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Fri Jun 29 13:13:32 EDT 2001 | Brian W.
What workmanship standard are you working to? The IPC book has an allowance for boards with heatsinks or thermal masses that allow less than 75% barrel fill on through hole parts. I would suggest that you check your board layers and determine if yo
Electronics Forum | Tue Aug 03 08:38:42 EDT 2004 | davef
Conductive epoxy is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask).
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Thu Sep 07 16:50:44 EDT 2006 | greg york
Just reading these comments are really interesting but very baffling. That if the solder manufacturers produces solder which 'is' actually Virgin high quality material and treated with conventional metallic anti drossing agents AND continue to add th
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