Electronics Forum | Mon Dec 13 21:05:34 EST 1999 | Curtis T.
Ken, we always build the bottom side of the board first. That also insures that there isn't any problems with the actives being reflowed and falling off in the glues curing process. By the way we do both paste and glue on the bottom of the boards t
Electronics Forum | Wed Dec 08 11:12:07 EST 1999 | Brian W.
I think the number is about 80 degrees C. If the board is hotter than that, glue problems start to occur. John is right. The adhesive starts its cure process and its release from the nozzle is inhibited. Fans and coolers are one way yo go. If yo
Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter
I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Tue Oct 16 18:42:32 EDT 2001 | mparker
I go with DaveF's advice. You are probably curing the glue too fast. Another phenomenon that I have experienced was during glue cure and solder paste reflow simultaeously. A good reason to run a glue cure profile seperately from solder paste reflow
Electronics Forum | Thu Jul 12 10:23:30 EDT 2012 | blnorman
Check with your adhesive manufacturer. In a previous life we had one line that was either double sided reflow or wave following reflow. When it was ds reflow, we just shut off the wave. When it was reflow/wave, we kept the reflow oven on with the
Electronics Forum | Sun May 12 21:06:33 EDT 2024 | ttheis
Hot melt dispenser mounted to a cobot. If you don't want to do it by hand, have a robot do it.
Electronics Forum | Wed Jul 18 08:50:35 EDT 2001 | Andy Gresko (Gresko Associates)
Aaron, You may want to consider a bead of hot melt glue similar to that used by hobbyists. There are various formulations with different melting temps. Andy
Electronics Forum | Tue Nov 30 13:20:07 EST 1999 | John Thorup
Hello Wolfgang Try looking in the process guides section of Circuit Technologies web site. Their recomendation is to bond the jumper wire to the board within 6mm of the lead with hot melt glue, cyanoacrylic glue or adhesive dots. John Thorup
Electronics Forum | Mon Oct 31 13:37:51 EST 2005 | slthomas
I would second the hot melt glue method. You do have to teach the importance of "more is not always better" and there will be learning curve, but it's a lot better at securing big clunky electrolytics than RTV. It's also a lot cheaper than chipbonder
