Electronics Forum: hot slump test (Page 1 of 21)

Gloves turned green while holding hot PCBA

Electronics Forum | Fri Apr 26 12:35:05 EDT 2002 | blnorman

Sounds like the mask wasn't properly cured. What kind of solder mask is it? We use a photoimageable mask on our boards. The secondary cure is ~ 90 minutes @ 150�C. One of the cured mask tests is solder bath resistance where it has to resist degra

How to choose a new solder paste

Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp

Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux

Re: solder balling

Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis

Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal

Components Solder Short

Electronics Forum | Fri Jul 21 13:34:54 EDT 2006 | fredericksr

hot/cold slump, print misregistration

Bridging Problems

Electronics Forum | Fri Mar 14 08:38:15 EDT 2008 | davef

Pastes from different suppliers have different hot slump characteristics

Solder bridging on IC leads

Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22

Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc

Re: Solder paste temp Humidity controls

Electronics Forum | Wed Mar 10 09:52:22 EST 1999 | justin medernach

| We are starting up an SMT line with a printer and convection oven.... The area we are considering for the printer is totally uncontrolled for humidity, temperature and even cleanliness. | | We are working on the filters to keep particulates down,

solder paste volume spread

Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef

Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan

And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an

Misalignment during Reflow

Electronics Forum | Thu Nov 18 00:13:09 EST 1999 | Thomas

10% slump). I am finding out their test std used but I think those lab test is different from real reflow as the heat transfer rate of reflow oven is much higher. Any one care to share your views?

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