Electronics Forum | Tue Jun 14 16:37:56 EDT 2005 | slthomas
You may be right. I may have read something into his post that wasn't there....
Electronics Forum | Fri Nov 07 23:40:41 EST 2008 | padawanlinuxero
I have been working on the SMT area for a while now, must of my experience is on programming and pick and place, now in my new job I have to control a complete SMT line and I have a little knowledge on working with solder paste but I like to read mor
Electronics Forum | Mon Jun 27 12:02:47 EDT 2022 | proceng1
I have never used a VP oven, but I did get a pretty good demo of one and was pushing hard for my company to acquire one. The issue ended up being that there was not an East Coast distributor for the "juice" and that became cost prohibitive to get sh
Electronics Forum | Tue Jan 03 15:31:51 EST 2023 | griinder
I use a DTF instead of PTF, but one thing I wondered reading this...Which pocket do you designate as "First Pocket" for your tray in your Feeder.db? Could this be affecting the XY position being returned by the machine? For DTF I use upper left. Shou
Electronics Forum | Sat Dec 10 08:26:14 EST 2022 | poly
That procedure all works perfectly, and I'm read through that section of the manual however... 12. Perform Feeder Teach. Refer to the Feeder Teach Voyager help topic. I can't find anything in Voyager that explains the feeder teach procedure for t
Electronics Forum | Mon Jul 04 14:21:14 EDT 2011 | davef
The three primary causes for bubble generation in solvent-based coatings are: * Air entrapment * Solvent flash-off * Curing the coating too quickly Tell us more about your process including: * When you first notice the bubbles * Extent of the probl
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish
how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile
Electronics Forum | Mon Jul 16 21:39:40 EDT 2001 | davef
The method you suggest is about the only way to �clean-up� this terrible situation. Realistically, this is a "memory" type condition induced by design, build symmetry, "cross ply construction", excessive cool down rates during lamination or reflow a
Electronics Forum | Thu Jun 30 13:33:23 EDT 2022 | emeto
Very interested what kind of profiler you use to check your profiles? KIC and Datapaqs have some predictors when it comes to reflow ovens or wave machines.
