Electronics Forum | Mon Sep 18 18:17:56 EDT 2017 | chintan
IS there an IPC standard or equivalent which specifies the maximum thickness of intermetallic compounds (IMC) in a reliable solder joint?
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Electronics Forum | Fri Jan 29 12:04:13 EST 2010 | davef
In response: * We know of no "videos about Pb-Cu intermetallic." Intermetallics are usually observed in microsections of solder connections. * We are unaware of "Pb-Cu intermetallic." In most soldering results in a copper-tin intermetallic. * Trainin
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Tue Aug 18 10:05:11 EDT 1998 | Ben Salisbury
Question: If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? I'm currently running into this proble
Electronics Forum | Wed Aug 22 17:00:51 EDT 2001 | Doug Chambers
I am researching articles with respect to intermetalics growth associated with gold as a final metalization. We are currently looking at a few options that include a 10uin flash followed by a 30uin selective and a total 30uin finish. The concern is
Electronics Forum | Fri Feb 11 09:44:01 EST 2005 | pjc
A touched-up solder joint is never as reliable as one soldered correctly by machine. Touching up adds more heat thereby increasing the thickness of the intermetalic bond. Our goal is to have the thinest intermetalic bond in our solder joints. The int
Electronics Forum | Fri Feb 15 17:50:30 EST 2008 | stevek
Creating a sound tin nickel intermetalic takes a bit more energy than other finishes (such as copper or tin). You can achieve wetting, but not have a viable intermetalic. You should cross section some intact boards from that process and see what th
Electronics Forum | Wed Nov 17 10:03:29 EST 2010 | scottp
Instead of a minimum thickness, we require no exposed copper or SnCu intermetallic. We've been having a lot of trouble lately with suppliers of SN100 HASL boards giving us pads with very irregular solder deposits with areas of exposed intermetallic.
Electronics Forum | Tue Aug 18 16:10:40 EDT 1998 | Earl Moon
| Question: | If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? | I'm currently running into this
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