Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Fri May 27 17:21:35 EDT 2005 | mrclean
Dear SM Rookies, Another acceptable test method is visual inspection. IPC-A-610 details what to look for with different contaminants, providing magnified pictures of the possible visual residues. With an existing cleaning process, magnification
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Wed Sep 22 22:18:37 EDT 1999 | Dave F
| I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb)
Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer
| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard
Electronics Forum | Thu Sep 23 10:17:26 EDT 1999 | Earl Moon
| | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/P
Electronics Forum | Thu Sep 23 10:29:34 EDT 1999 | Dave F
| | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn
Electronics Forum | Thu Sep 23 11:35:10 EDT 1999 | Earl Moon
| | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no
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