Electronics Forum: ipc-a-610 lead protrusion (Page 1 of 8)

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Tue Mar 15 16:51:59 EST 2005 | Praveen

Hello: I am looking for papers/information on correlation between lead protrusion and reliability studies conducted on Through-Hole Technologies. I would really appreciate it if information on the same could be made available. Thanks and have a nic

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT

I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT

TSOP lead deformation (help)

Electronics Forum | Mon Jan 26 10:15:51 EST 2009 | john123

Can anyone help me determine the acceptability level for lead deformation (see attachment). The outer two leads on the left side were bent during the pick and place centering operation. I've looked in the IPC-A-610 book and could only find informa

Heel bend wetting for Gull Wing lead

Electronics Forum | Fri Apr 13 07:25:06 EDT 2007 | davef

Your paste should meet the mid-point of outside lead bend. If you cannot meet that, IPC-A-610D, 8.2.5.6 defines the minimum. We agree that it gets confusing when you post multiple threads on the same or very similar topic.

Micro crack for lead free wave solder

Electronics Forum | Tue Aug 02 22:49:55 EDT 2005 | davef

IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Lead-free soldering anomalies Hot Tear / Shrink Hole is one such anomaly. This shrinkage effect appears primarily on wave-soldered joints, but can also

SMT electrolytic capacitor lead classification is???

Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks

Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS

Have you seen IPC-A-610 D ? regards GS

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

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