Electronics Forum | Tue Sep 25 12:00:21 EDT 2012 | kkay
Thanks for fixing the picture. What you are looking at is a pad that the part was pried off of after reflow. The right side of the pad shows a good solder joint and underneath the part is where the voids occur. The outter solder joints show no voids
Electronics Forum | Tue Dec 31 11:48:36 EST 2019 | emeto
Hello experts, I have a 50mmx50mm LGA on a PCBA. I Would like to decrease voiding in these joints and I wanted to hear about your techniques to decrease voiding. Stencil is currently 5mil. SAC305. ENIG finish.
Electronics Forum | Fri Jan 03 02:03:58 EST 2020 | sssamw
What's your target for voiding? I cannot see it violate 25% of solder joint area. Process setting and PCB design can impact the voiding, many factors, such as PCB pad, stencil aperture and thickness, re-flow profile, solder paste, etc.
Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto
Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Wed Mar 23 20:44:25 EST 2005 | pmd
Sounds like EA has way too much free time on his hands. How are you taking a reading. What instruments are you useing to get a reading. What are you looking for? Voids? Adhearsion? Contamination? Why would you need to know what it takes to break a co
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
Electronics Forum | Tue Sep 04 02:28:17 EDT 2007 | philip_yam
Any one has experience over solder voids in oscillator capacitor joint could result in high phase noise during the digital performances test? The noise signal was gone after solder touch up. What could be the root cause of the high phase noise?
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
