Electronics Forum | Fri Jul 15 18:21:55 EDT 2005 | dggjr
We have Kester 256 no-clean spec'd as an alternate paste. I bring some 256 in occasionally to make sure it still works as a backup. The last batch I brought in was bridging like crazy. Scraped it off the stencil, put our regular Alpha back down an
Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Thu Jan 20 17:14:39 EST 2005 | jbrower
Today, I have just finished evaluating Kester's EM907 (SAC305)lead free solder paste and found that for our applications it performs as expected. End result that I am encouraged with the results that we got. The equipment that I used: An SMT2020 to
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Fri Jul 18 10:23:06 EDT 2003 | James
The parts adhere solder very well. It does not pertain to a certain part on the board either it is all over the board. I cant really say that it is oxidization all you can tell is that on certain parts of the pad still shows like white tin and that
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Fri Jul 06 12:39:01 EDT 2007 | blnorman
What's the metallization on the board? We use an immersion tin board and had to increase our profile to successfully solder.
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Fri Jan 16 14:42:44 EST 2009 | realchunks
Kester R562 is a 63/37 paste. Not ideal for no-lead parts. I bet you are seeing no-lead BGAs and they will become very weak using your old proile and paste (been there - done that). You can try a hotter profile but will probably just burn off your
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