Electronics Forum | Thu Mar 02 17:32:09 EST 2006 | sphilips
The initial cost of the battery is similar to saying the size of an iceberg is measured only by what shows above the waterline. There is a lot more to it than at first blush. The ECD Power Pack costs $245, but provides over 3500 hours of profiling.
Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Wed Apr 08 12:29:08 EDT 1998 | Justin Medernach
| Is it just me, or does anybody else have problems with open connections on small surface mount headers and connectors? I am talking about small 20 to 40 pin devices, 25 to 50 mil pitch. We put these things on the board, the feet look like they ar
Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef
First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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