Electronics Forum | Tue Jan 03 13:45:14 EST 2012 | adlsmt
What would be the best router to use that would allow clearance on the top side for large components and long wires on the top side of the board? High volume so must be fast.
Electronics Forum | Thu Aug 10 05:53:10 EDT 2000 | pascal MATHIEU
hello everybody , i am looking for the elementary caution you need to take when you reflow large board with several thousands of smt components . thank you for your advise
Electronics Forum | Thu Aug 10 21:59:14 EDT 2000 | Dave F
Pascal: Two elementary cautines are: 1 Don't dump the board before the reflowed solder is cooled. 2 Try to manage the side to side temperature variations in your oven. I wouldn't be surprised to see 5�C variation. Good luck
Electronics Forum | Thu Jun 15 07:20:23 EDT 2006 | William G.
How are your experiences with stencilling 0201 components on large circuit boards, i.e. 400 * 250 mm ? Will there not be too much mismatch between between stencil and (FR4) boards? If so, would dispensing be a solution? Any other solutions?
Electronics Forum | Thu Jun 15 07:39:04 EDT 2006 | Chunks
Dependig on your process. If you use the same Gerber data that made the board to make your stencil, by a reutable stencil manufacturer, then no you should not have any mismatch issues.
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t
Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher
I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe
Electronics Forum | Wed Jan 14 16:52:40 EST 2009 | vleasher
We currently use Epibond 7275 and it cures way too quickly to allow the component to settle down on the board. Have you used the Loctite 3609 in the application i'm speaking of with success?
Electronics Forum | Wed Jan 14 17:07:46 EST 2009 | davef
In BIG-boy, high vibration applications to secure large components, we've used 3M #2214 structural adhesive [One part, 250*F (121*C) curing 100% solids, paste consistency epoxy adhesives designed for bonding metals and many high temperature plastics
Electronics Forum | Mon Sep 23 20:00:21 EDT 2002 | kenbliss
Hi Reg We are not local to you, we are in California, but we can easily ship to you there. However we sell mat material in many types and sizes, cut to size if needed. We also offer trays for the mats for doing the type of work you describe. I do
