Electronics Forum | Wed Jun 26 22:05:35 EDT 2019 | SMTA-Chi Hong
Hello all, Recently there is component SOIC8L HD leadframe with the exposed Cu on shoulder side and lead tip. Is anyone have experience running with this type of component?Thanks
Electronics Forum | Fri Apr 19 08:46:04 EDT 2002 | geoff_goring
I would like to discover more about Zinc/Lead diffusion in the leadframes of SOIC ASICS.
Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel
hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro
Electronics Forum | Tue Apr 01 19:45:48 EST 2003 | mk
Try checking into ssd www.sipad.com No clean process for the whole board. Contamination from paste is removed before you get the boards. http://www.sipad.com/Motorola/MotorolaFlipChip.htm mkehoe@sipad.net
Electronics Forum | Thu May 06 17:23:02 EDT 2004 | davef
Ah, here it is: EFTEC-64T. A commercial leadframe material with the nominal composition of Cu-0.3Cr-0.25Sn-0.2Zn
Electronics Forum | Tue Apr 26 03:28:26 EDT 2005 | Just mee
What test is applicable to check for QFN package with NiPdAu leadframe if leads/pad are solderable? what are the options other than dip and look solderability testing? Thanks,
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Fri Jul 30 18:34:51 EDT 2010 | ranas
hi, just want to seek info regarding LF supplier who can do flip chip LF with solder nuggets. our supplier from USA is going to be closed due to financial constraint.. Anybody who can recommend.. asia location is preferrable.. thanks, Ranas
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Mon Sep 16 03:10:32 EDT 2002 | stefano_bolleri
Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, ther
