Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack
Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad
Electronics Forum | Mon Dec 04 15:23:31 EST 2017 | kojotssss
A new stencil has been purchased. to be continued.
Electronics Forum | Fri Nov 10 22:31:27 EST 2017 | myke03o
Hi, we are experiencing insufficient solder and bridging solder. Any recommendation on the inner pad (LGA) and stencil thickness. Any suggestion will be very helpful. link: http://www.latticesemi.com/~/media/LatticeSemi/Documents/ApplicationNotes/
Electronics Forum | Wed Mar 02 05:01:41 EST 2005 | ABHI
Are your packages mounted on boar using sockets or BGA balls? LGA's are usually no issue and are simple compared to BGA. No issue on missing balls or ball drop issues. However, LGA's need quite a bit of mounting / holding pressures during test and mo
Electronics Forum | Fri Dec 01 14:50:30 EST 2017 | kojotssss
How about step down in the middle of thermo pad? I mean 0.075mm This can help?
Electronics Forum | Thu Mar 19 11:31:14 EDT 2015 | duchoang
We remove the LGA, clean the pads, "re-ball" the LGA by solder-printing it, reflow and re-install it on board as BGA. That way, we don't need to apply solder paste on board. It works !!!
Electronics Forum | Wed Apr 09 09:44:12 EDT 2003 | iman
yes, we r profiling direct thermocouple attachment to the LGA pads. based on direct experience of yourself or others, what paste (brand/type3?/type4?/alloy?/flux%?) gives the optimal repeatable characteristic-patterns to minimize this defect?
Electronics Forum | Sat Nov 11 11:11:28 EST 2017 | spoiltforchoice
One suggestion I have seen for packages like this is to have the device balled first.
Electronics Forum | Fri Dec 01 13:30:08 EST 2017 | kojotssss
Stencil thickness is 4 mil. Via's are plugging from bottom. Gas may be developed under the component? Take Reflow Ovens Thermal Profiling changes? In your opinion?
Electronics Forum | Fri Dec 01 14:11:24 EST 2017 | kojotssss
EMIL, The first stencil was with 4 squares. then there was a worse percentage. Changed to the circles. Is better, but still not perfect. Stencil thickness did not change. I added 2 types of stencil openings. Pictures of watch:
