Electronics Forum | Fri May 26 01:50:54 EDT 2000 | Craig
We have no experience in printing glue only in dispencing for short runs. We are finding that our gluing volumes are going up and want to look at screen printing as an option. We are placing 0805 and 1206 chips, melfs, sots and ics. What are the adva
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Tue Aug 24 16:11:21 EDT 1999 | Scott Cook
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
Electronics Forum | Wed Nov 28 09:17:17 EST 2001 | Dave G
I've heard of reliabilty problems caused by wave soldering melf's as well. We don't put Melfs on the bottom of our PCB's on newer designs. We only have to deal with gluing & putting them through the wave on some of our older legacy designs. Increasi
Electronics Forum | Tue Nov 27 10:56:42 EST 2001 | jmathis
Hello, Our company has been successfully using Loctite 3612 for screen printing glue. Resently there has been a HUGE issue with the melf components falling off or tumbstoning during the wave process. It's apparent that these components were cured
Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Tue Nov 27 15:37:15 EST 2001 | Dave G
I've seen some glass melf's fall off in our facility due to the glue not adhering to the body very well. You could pick these off with your finger after they had cured. (With little or no effort - I never bothered to actually measure the force requir
Electronics Forum | Fri Aug 12 17:36:06 EDT 2011 | grics
Dave is correct. Also, you should check the TDS's of the caps and the display before processing to see if they can withstand the process temps, look for a recommended solder profile or info for the manufacturability of the device. On another note,
Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker
Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr
Electronics Forum | Mon Nov 04 16:54:13 EST 2002 | pjc
For me it was the 1.0mm nozzle, if we're talking mini-MELF here. Also, slowing the turret speed helps. Had mine at 30%. Results vary if placing on paste vs. glue. Paste is better. Still, the std. 1.0mm nozzle is where near as good as with the MELF no
