Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Fri Nov 08 05:40:54 EST 2019 | leeg
We place these on a few boards and have no issues with reflow or warpage. How thick is your PCB?
Electronics Forum | Thu Nov 07 10:07:02 EST 2019 | charliedci
Requesting help from anyone with experience in reflowing Te Connect, PN 1565917-4, 200 pin connecter. Pic attached. Cannot get all 200 pins to wet, main suspect is slight PCB warping during reflow. Have adjusted reflow profile. A 2.75 inch long SMT c
Electronics Forum | Fri Nov 08 14:45:12 EST 2019 | charliedci
Appreciate the input from everyone. The PCB is .062" thick. As a CM we are at the mercy of our customer at this point although (hopefully) they are receptive to advice on the next build. Titanium strips could be an option, I also thought there might
Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Fri May 26 14:03:52 EDT 2000 | GP
I have a problem on fine pitch SMT connector reflow. The board size is 18" x 12" with 8 layers FR4 material and emersion gold finishing. All the other components include 0603 on the board are reflow very well, except 20 mil pitch SMT connectors. The
Electronics Forum | Wed Dec 04 04:29:51 EST 2002 | CH
U might need to run the board on a reflow pallet with a clamper. This will help to solve the warpage problem on the PCB and connector.
Electronics Forum | Fri Nov 22 13:41:55 EST 2002 | cristiano
We are experiencing problems with a smartmedia connector during the reflow solder process. The connectors stay a little bended after the oven. In this case the middle leads are not solded, because they stay with no contact on the board. The conector
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef
From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n
