Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Tue Oct 07 13:01:48 EDT 2014 | charliedci
does anyone have experience with reflow of Micro SD cards to PCB@ lead free temps?
Electronics Forum | Wed Apr 16 19:23:52 EDT 2008 | molos21
I think you are close to the problem when you expect the pcb having a problem. When I look at your different pics I saw that your via holes looks like this pcb has a hasl finish... and when i look at Q 14 this picture tells me that the pcb is not an
Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework
I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free
Electronics Forum | Mon Jul 12 10:21:06 EDT 1999 | Earl Moon
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
Electronics Forum | Tue Nov 07 10:25:19 EST 2000 | Thomas Ballhausen
Thank you for your kind contribution and efforts in helping me. I just found out we have been talking different units; my microns were micro meter ...? So, let me get things right now: the substrate supplier confirmed the following data: Cu foil +
Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc
Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
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