Electronics Forum | Thu Mar 07 09:46:36 EST 2002 | cfraser
If you are having problems with missing, misplaced RLC on your Fuji CP you should take a look at your board supports in the machine. Lack of or improper board support and bad feeders are the most common causes of misplaced RLC's.
Electronics Forum | Mon May 08 01:47:56 EDT 2000 | Jack
Charles, I think the misplacement can be devided into 2 groups: 1. parts misplaced by machine 2. parts move as the X-Y table moves If you use the solder paster right, and the place force is properly setup, the second group will be definitely no exce
Electronics Forum | Tue May 19 14:32:40 EDT 2015 | duchoang
I agree. 100%.If the parts are offset 50% or less on pads, no problem.
Electronics Forum | Mon Dec 06 09:28:11 EST 1999 | Dave F
Glen: So that's this metal? Is it in the area of PTH or SMT solder connections? Etc, Etc. Assuming its near connections where pasted is reflowed ... Reflow defects, bridging: misplaced components, high placement force mushrooms paste, too much p
Electronics Forum | Fri May 15 08:18:17 EDT 2015 | emeto
We all agree that you need to have your machine fixed. It probably needs calibration. Using Lead paste will help the parts to self align in the oven - however your misplacement should cover at least 50% of your pad. Pb free paste will not self align
Electronics Forum | Tue Sep 05 13:31:14 EDT 2017 | cyber_wolf
I am not sure why you would have an issue placing a DFN with your TP-9. Is the machine throwing it away or mis-placing ? Throwing the part away could have several reasons and so could mis-placement.
Electronics Forum | Wed May 24 13:42:27 EDT 2000 | John McGriff
We just had a similar problem with misplacement, and it turned out that the designers had not put the local fiducials in the right places. I am told that placement machines typically recalculate the component centroid to be at the center of a line b
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman
A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side
Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
