Electronics Forum | Fri Mar 26 00:57:05 EDT 2010 | 89jeong
Hello Sir. We also have faced a same problem. At that time, we had to repair it because we could not find any solution. But in our experience, the void underneath FET was more severe whenever we used the FET that have been made long time ago. It is
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Thu Sep 02 21:51:54 EDT 2004 | davef
Curious, but thoughts are: * Your pretinning pot is loaded with gold that has been removed from lead over a period of time * Your failed solder connections are caused by something else other that gold intermetallics * Your tinning process is undiscip
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Tue Nov 25 22:25:24 EST 2003 | davef
We had a similar problem on the high impedance front end of a MOSFET amplifier a few years ago. If your situation is like ours, the issue is not what a consensus specification [like J-STD-001] defines as an upper limit, but what your product is defi
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