Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Thu Sep 13 22:06:02 EDT 2007 | davef
While you're waiting for others to respond, here's one take on bismuth in lead-free soldering [ http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Articles⊂section=Display&ARTICLE_ID=229915 ] by a long term friend of SMTnet. Find more by sea
Electronics Forum | Sun Sep 23 18:59:59 EDT 2007 | darby
I presume you are looking at low melting point solders. Firstly, I would consider running BOTH sides with the same paste - this will cut down the opportunities for a mix up with rework or retro-fit. Secondly, check that there is a cored wire availabl
Electronics Forum | Wed Mar 19 20:40:27 EST 2003 | arminski
Vapor Phase process can do reflow from 4 to 5 times!
Electronics Forum | Thu Mar 20 09:40:33 EST 2003 | russ
Are you warping the BGA or the PCB? Russ
Electronics Forum | Thu Mar 20 14:17:39 EST 2003 | MA/NY DDave
Hi I don't think I will enter this too much except for one of your questions. YES multiple reflows affect reliability. Heck most everything affects reliability. Aggressive Heat cycles or Heat always affects the final MTBF reliability number. The
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Fri Mar 14 04:29:06 EST 2003 | emeto
Hi, It's not recomended to do more reflows.Reliability of the boards decreases and a lot of defects appear.Try to repair other way- hot air or something like that.(main is to be local)
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Wed Mar 19 16:12:51 EST 2003 | Sudhir
I would suggest to have a rework station to rework only a single component we are having a genrad rework station to do these things