Electronics Forum: my600 angled componants (Page 1 of 21)

Best Jet Printer? MY600?

Electronics Forum | Tue Apr 05 18:50:00 EDT 2016 | bootstrap

Roughly what is the price of the Essemtec Scorpion? Is that capable of applying solder paste for 0201 discrete components and 0.40mm to 0.50mm pitch BGAs? Also, what is the difference between my500 and my600? Are both currently made models? And r

Solder Paste Pin Transfer vs Time Pressure Dispense

Electronics Forum | Thu Jul 20 13:32:11 EDT 2023 | spoiltforchoice

I doubt either Mycronic or Essemtec, as the only people who do dispense printing, will want to share their research with you. But clearly they will have followed every valid option to determine what is possible. Time & pressure is not used for anythi

New to solder paste jetprinting

Electronics Forum | Wed Oct 07 15:46:36 EDT 2020 | tamasmagyar

Hi Hearse, I currently use a MY600, with a AG Ejector which can place dots between 0.33 and 0.52 mm. The differences for a MY600 with placing small dots is down to ejector and paste. To be able to place dots as small as 0.25 mm, you would need an

High-speed solder paste dispensing. MY500, MY600, FX-D....?

Electronics Forum | Tue Dec 23 09:13:12 EST 2014 | jeff701

I'm in a manufacturing environment with a very high mix of boards, and some low-mid volume. A "large" production run might consist of 100 boards. Volume: There are numerous boards that have a volume of 1-3 pieces. There are a few boards with an annua

Best Jet Printer? MY600?

Electronics Forum | Wed Mar 02 02:07:06 EST 2016 | mbass

3000 components per side and yes the actual print cycle is longer (13 minutes) against the DEK print stroke of 30 seconds. But overall the whole cycle time of set up etc is way less on the MY500. The ability of the machine to adjust volume of paste o

Philips pick n place angle

Electronics Forum | Fri Jan 04 14:42:20 EST 2013 | mcox

Philips Gem Topaz - Does anyone have a decoder ring for calculating the correct place angle for components. I am looking for a fool proof way to program the correct angles depending on how the parts are supplied to the machine. Thanks Mike

Die bonded at an angle in a QFN component

Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan

Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.

Conveyor Angle - Wave Soldering

Electronics Forum | Thu Jan 13 10:30:14 EST 2011 | SheanDalton

My recollection is 6 degrees; but, I suspect the type of wave formation on the backside has an effect. Here's a few notes from an old fishbone chart: Too low angle: excessive solder, icicles, bridging High angle: insufficient solder, voids or outga

Die bonded at an angle in a QFN component

Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef

That is unusual. Is it a once-off or SOP for that part?

Die bonded at an angle in a QFN component

Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto

Very interesting. Looking at the wire bonding, it seems that it is all normal.

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