Electronics Forum | Thu Sep 02 20:39:39 EDT 2010 | Jacki
Hi davf Our process is the manufacturing burn-in-bord, SMT,insert sockets, wave and touch up. 1 board needs 0.1UF about 3k+ components.Kemet recommanded to use the reflow machine for Ceramic Cap when i chked its website.
Electronics Forum | Thu Aug 29 20:01:23 EDT 2002 | davef
Many people use the same spacing [and pad designs] as they use for primary side SMT. We don�t. DOWN STREAM SMT-TO-SMT SPACING: In addition to proper orientation, components cannot be immediately upstream of terminations that are to be soldered or b
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