Electronics Forum: nh4 contamination spec (Page 1 of 12)

cleaning spec

Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz

I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam

Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..

Lead contamination in wave solder pot...

Electronics Forum | Wed Oct 12 11:19:46 EDT 2005 | patrickbruneel

Yeah, adopting is the right word. In this new lead-free era spec.'s are made to stay within the scoop of the RoHS directive. The driving force for spec.'s should be reliability. Did you see any impurity level spec.'s yet in wave soldering for Cu, Au,

Lead contamination in wave solder pot...

Electronics Forum | Tue Oct 11 22:58:19 EDT 2005 | KEN

Isn't it funny how solder manufacturers are adopting a spec. limit of "not to exceed 1000ppm of lead content". Doesn't leave much room for the rest of the "process".

Golden Ground Pad Contamination with Solder

Electronics Forum | Thu Nov 16 23:05:40 EST 2017 | slah6678

What is the IPC Spec for Golden Ground Pad Contamination with Solder ? Especially for Automotive product.

voids when waving

Electronics Forum | Mon Mar 12 08:27:00 EDT 2007 | rgduval

Have you checked the parts for contamination? Are the voids out of spec? IPC allows some voiding, especially with lead free solder. Component contamination can cause this to repeat, as well. Try pre-tinning the component in question, and see if s

ENIG CONTAMINATION

Electronics Forum | Tue Nov 03 16:55:48 EST 2009 | tstrat

If the contamination came from the SMT process I would have expected it to be present in the joint above the finish. It is isolated to the EN layer in the ENIG finish. We are doing more analysis to determine the number of boards with the contaminatio

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Fri Dec 06 12:24:03 EST 2002 | Mike Konrad

Military and most commercial standards requires post-soldered boards to measure less than 10 �g/in of NaCl (14 when using an Omegameter, 20 on a Ionagraph, and 37 on a Zero-Ion). As Dave stated, 6.5 �g/in of NaCl is called out in Mil-P-55110 for ba

Re: Mil-P-28809

Electronics Forum | Mon Oct 11 12:27:48 EDT 1999 | Mike Demos

Thank you all for your replies. I guess my age in this industry is showing. This military spec. does not appear to be in existance. So, let me make my request a little more to the point: Is anyone aware of a specification specifically referencing

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Thu Dec 05 15:06:53 EST 2002 | cbudzinski

HI can anyone tell me if they ask there board houses to hold to a max amount of contamination NaCl per sq /in on there incomming bare boards, I have a Ionograph 500SMD and have been testing some of the bare boards comming in to stock, some are much

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