Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef
Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat
Electronics Forum | Wed Sep 01 05:25:34 EDT 2004 | Martin
Hello, I am looking for some advice please about how to go about plating some brass pins for a new assembly. (which will be hand soldered) I have spoken to a couple of "experts" who seem to contradict themselves.. Firstly what should I be solderin
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
Electronics Forum | Thu Apr 02 14:58:49 EDT 2009 | vladig
Hi Peter, Have the plating thickness checked with XRF. If the layer of Au too thin, then Ni can diffuse all the way through it during the first run and the surface won't be perfectly solderable for the second side. it might also have a thin layer of
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Tue Mar 31 05:26:14 EDT 2009 | d0min0
Hello, we had similar problem in the past - when we had to change PCB supplier from a batch of hundreds of boards (NiAu plated, SnPb process) we got 2-3 boards with paste wicking to components leads what we did, was to check the thickness of gold on
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