Electronics Forum | Thu Jan 06 15:51:08 EST 2011 | flipit
Nitrogen increase surface tension in solder. This also reduces solder balls.
Electronics Forum | Wed Jan 05 23:46:10 EST 2011 | Shean Dalton
In addition to reducing oxides my understanding is that nitrogen increases the surface tension of solder (I've also read the inverse). Bottom line, Nitrogen reduces rework, improves quality, improves solder appearance, and reduces maintenance. Shea
Electronics Forum | Sun Sep 09 10:53:05 EDT 2001 | bentzen
For reflow soldering, you are correct ! The higher surface tension of the solder paste in nitrogen atmosphere can increase the number of solder bridges if the component or solder paste print is inaccurate. Another defect that might increase is tomb
Electronics Forum | Sat Sep 01 06:09:25 EDT 2001 | opor_a
Hi guy Please help advise me the impact of using Nitrogen to solder bridging defect. I heard somebody said that using nitrogen can effect the bridging problem by higher surface tension in case inaccurate printing . Is it true? Thanks.
Electronics Forum | Wed May 12 20:43:53 EDT 1999 | Earl Moon
| Folks, | I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? | It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. | What
Electronics Forum | Fri Sep 07 08:57:28 EDT 2001 | Hussman
Por, You talking wave solder or reflow solder? At wave, nitrogen is the way to go. Just like you stated, it does affect the surface tension. If you're reflowing, I wouldn't go nitrogen unless you have to. Improper stencil design is usually the c
Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
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