Electronics Forum | Tue Sep 26 20:19:51 EDT 2000 | Dave F
Never heard of N-Tech. Whose material do they use? Two common materials are: Imidazole (Via Systems) and Entek (Enthone) OSP is a lacquer that fabs apply to boards by either spraying or dipping. What thickness control does your fab use? For inst
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Tue Aug 20 19:15:39 EDT 2002 | stownsend
On a gold plated PCB, when in the PCB fab process is the gold plating applied? How about OSP, when in the process is OSP applied?
Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca
Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe
Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Wed Apr 04 08:57:13 EDT 2001 | Cal
IPC-TM-650 is a works well. Ionic conductivity is a good rule of thumb but I prefer ION Chromatography this will help determine the residues left behind from the fab process. There are a bunch of ways to determine solderabiltiy- Wet Balance and SERA
Electronics Forum | Thu May 28 22:17:18 EDT 2009 | davef
If your fabricator understands and controls their in-house ENIG, you should be OK. It seems that fabs don't undererstand ENIG processes well enough to duplicate hyper-corroded nickel, but those that have not seen the defect usually never see it.
Electronics Forum | Tue Dec 27 18:24:46 EST 2022 | davef
Certainly, you need to take proper precautions in storing assembled boards. The main unknown: OSP changes after soldering, whether it remains solderable is the question. A lot of that has to do fabrication of your boards. Your fab will have insights
Electronics Forum | Thu Sep 02 14:02:49 EDT 2004 | russ
Frank, We are currently running lead free for approximately 1 yr. now but no where near the volumes you have mentioned. We are about 5k units per month. I personally am in agreement with you as far as OSP. I also do not like white tin finish since
