Electronics Forum: osp reflow process (Page 1 of 317)

osp

Electronics Forum | Wed Dec 20 15:21:06 EST 2000 | OS

How should OSP PCB be handled, when stored; and during manufactruing process on production floor?

osp finish

Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef

Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.

N-tech osp problems

Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg

I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this

intrusive reflow process

Electronics Forum | Tue May 28 11:42:06 EDT 2002 | anthonyb

Jim, What are the limitations of the intrusive reflow process?

intrusive reflow process

Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli

Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint

PCB interval during reflow process

Electronics Forum | Fri Dec 03 03:06:45 EST 1999 | Charley Qin

Is there a generally acknowledged loading interval of PCB for Reflow proces?

Sockets Soldering with reflow process

Electronics Forum | Mon Jan 25 20:39:27 EST 2010 | aungthura

Dear all I hope someone could have very useful idea for sockets soldered by machine either Reflow or Vapor.And, kindly advise me. Thanks in advance.

lead free for multiple reflow process

Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam

We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l

baking out pcbs after reflow process

Electronics Forum | Wed Jul 11 22:44:50 EDT 2012 | joeion

Why cannot reply????

Re: PCB interval during reflow process

Electronics Forum | Fri Dec 03 18:27:09 EST 1999 | Dave F

Charley: As Wolfgang says, you're unlikely to be able to put enough (average) boards in a modern reflow oven to be able to thermally load the machine. Ta Dave F

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