Electronics Forum | Fri Oct 25 16:40:06 EDT 2002 | davef
Nor ment as a criticism of anyone, but you really need to become intimate with your stencil supplier. This is not one of those "throw it over the wall" buying relationships, like you can have with buying pencils. View this an opportunity to develop
Electronics Forum | Thu Apr 11 19:12:11 EDT 2002 | djarvis
Sorry fellas -disagree. We only clean our stencils in the ultrasonic machine at the end of the run. If the same pcb is up the next day we clean them by hand. We use Electrolube SSS and the used rolls from the in line under stencil cleaner. Wipe the
Electronics Forum | Tue Feb 02 09:01:34 EST 2021 | denism
The main feature of the step on the stencil is the excess of paste on adjacent components. Clearance between step and fine pitch components must be at least 10 mm. Might better try over printing?
Electronics Forum | Wed Aug 31 10:50:50 EDT 2005 | aj
Grant, We run the exact same process as you described. 5 thou stencil, 1:1 ratio aj
Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith
I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing
Electronics Forum | Fri Mar 07 21:10:31 EST 2003 | neil
Remember the gold is only deposited to provide an air barrier so that the nickel does not oxidise. Normally the gold is absorbed into the solder joint so that the solder forms a joint with the nickle. It is not unusual to see gold remaining on pads i
Electronics Forum | Wed Aug 31 00:50:59 EDT 2005 | grantp
Hi, We have a new part we need to mount, and it's a .5 mm pitch BGA with .3 mm diameter pads. That's a lot smaller than we have done before, and we currently use 1 mm pitch BGA's with .5 pads. Has anyone does .5 mm pitch BGA's and what needs to be
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton
We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st
Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave
Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul
