Electronics Forum | Fri Oct 18 13:13:38 EDT 2002 | Matt
What size are the spheres? you could have them laser re-balled with no induced heat.
Electronics Forum | Fri Oct 18 06:33:28 EDT 2002 | johnw
Here's one for you lot, dos anyone have a method or a vendor that can clean the ball's of BGA's of oxides to bring them back to 'new' conditions ? I've got a bathc of components that are fairly old and I get some issues with soldering them which I b
Electronics Forum | Sat Oct 19 08:06:06 EDT 2002 | johnw
You know I knew I used this forum for a reason, probably the most complete knowledge base going. I too use Indium and yoru right the minite you hit any stuborn oxides then your bust. The problem however is that the customer tends to dictate what we
Electronics Forum | Wed May 28 19:21:09 EDT 2014 | hegemon
Just from the look of things (a picture) I would first guess it is a contamination problem on the PWB. Check over all your handling practices. Make sure the PWBs are NEVER touched by bare hands. I would not rule out the Black Pad phenomena, but i
Electronics Forum | Tue Apr 20 14:55:19 EDT 2004 | mrmaint
Does anyone out there know of a method to remove oxidation from the balls of a BGA, other than reball. thanks, MRMAINT
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Thu Feb 10 14:27:07 EST 2005 | cyber_wolf
First of all, whom are you getting it from ? Mydata, or a used equipment broker. If you can tell me what machine type you are looking at, then I can tell you what to look for. (MY-series, or TP series) Most important things right off the bat: *Machi
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
