Electronics Forum: panasonic flip chip bonder (Page 1 of 3)

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

Re: Gold Bump Flip Chip Attach

Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach

Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan

Re: Gold Bump Flip Chip Attach

Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon

| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech

Where can i find Chip-on-board Forum?

Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest

Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te

Which equipment - Assembleon, Fuji, Siemens, Univ., Pana.

Electronics Forum | Thu May 06 15:46:08 EDT 2004 | Automation Engineer

I am looking at putting in a 100,000+ cph assembly line capable of processing 8" X 8" boards. Mix is passsives down to 0402, 15 mil pitch flip chips. I would like to hear what comments you have on the new Assebleon AX, Fuji NXT, Siemens HS-60, Univ

Re: Create SMD machine?

Electronics Forum | Tue Sep 07 16:40:29 EDT 1999 | PC

| | Where do I find information about Create SMD machines? I don't know that is that Create real name, but it suppose to be manufactured by Matsushita. | | | | | Create ( AKA KME ) is not only a sister company to Panasonic Factory Automation but is

Re: Create SMD machine?

Electronics Forum | Sun Sep 05 23:24:13 EDT 1999 | Mike Dreyer

| Where do I find information about Create SMD machines? I don't know that is that Create real name, but it suppose to be manufactured by Matsushita. | | Create ( AKA KME ) is not only a sister company to Panasonic Factory Automation but is also a

Re: Product Segmentation in Pick Place Machines?

Electronics Forum | Mon Sep 13 10:55:44 EDT 1999 | K3 Equipment

| Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h

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